On September 3, SMIC issued an announcement this afternoon that the company signed a cooperation framework agreement with the Shanghai Lingang Management Committee on September 2. The two parties will establish a joint venture with a planned production capacity of 100,000 pieces/month 12-inch wafer foundry production line project.
SMIC focuses on providing integrated circuit foundry and technical services at technology nodes of 28 nanometers and above.
The announcement shows that the planned investment of the project is approximately US$8.87 billion, and the registered capital of the joint venture company is planned to be US$5.5 billion, of which SMIC’s planned investment ratio shall not be less than 51%, and the investment ratio determined by the Shanghai Municipal People’s Government shall not exceed 25%. %.
The company and the Shanghai Pilot Free Trade Zone Lingang New Area Management Committee jointly promote third-party investors to complete the remaining capital contributions, and subsequently adjust their respective capital contributions and equity ratios according to the capital contributions of third-party investors. SMIC will be responsible for the joint venture. Operation and management.
The announcement stated that the purpose of this cooperation is to grasp the strategic opportunity period for the development of the integrated circuit industry in the Lingang Free Trade Zone and promote the company’s business development.
SMIC believes that this project is conducive to promoting the company’s expansion of production scale and improvement of nanotechnology services, so as to obtain higher returns.
According to media reports, SMIC currently has a 200mm wafer fab in Shanghai and a 300mm advanced process joint venture wafer fab with actual control rights.
In addition, there is a 300mm wafer fab and a holding 300mm wafer fab in Beijing. In addition, SMIC has a 200mm wafer fab in Tianjin and Shenzhen.