On April 16, Foxconn’s official micro-signal issued a document saying that the Qingdao West Coast New District and Foxconn Technology Group launched a “cloud contract” activity through online video on April 15, and Foxconn Semiconductor’s high-end packaging and testing project was officially settled.
This project is jointly invested by Foxconn Technology Group and Fusion Holdings Group Co., Ltd., and encapsulates 5G communication, artificial intelligence and other application chips that are currently growing rapidly. The project is scheduled to start construction this year, put into operation in 2021, and reach production in 2025.
In addition, according to the report of the WeChat public account Qingbao Mountain of Qingdao Daily, Liu Yangwei, chairman of Foxconn Technology Group, said at the signing date that the high-end packaging and testing project of Foxconn Semiconductor is the core link in the chip design, manufacturing and application industry chain. The industrial chain and accelerating the upgrading and upgrading of industries have a leading role. This project will become an indispensable and important part of new infrastructure such as 5G communications, industrial Internet, and artificial intelligence, laying a solid foundation for the vigorous development of new infrastructure.
It is understood that the semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging, and post-package testing (package testing). Packaging and testing refers to the process of processing the tested wafers to obtain independent chips according to product model and functional requirements.
Previously, Foxconn had multiple semiconductor industry layouts on the mainland. In August 2018, Foxconn and the Zhuhai government reached an agreement to start construction of a 12-inch wafer fab in Zhuhai in 2020, with a total investment of 9 billion US dollars.
In September of the same year, Foxconn established a cooperation with Jinan Municipal Government to set up an investment fund of RMB 3.75 billion to support the development of the local semiconductor industry in Shandong. According to the agreement, Foxconn will use its own resources to promote 5 IC design companies and 1 high-power chip company to land in Jinan.
In November 2018, Foxconn’s Jingding Precision Nanjing Semiconductor Industry Base and semiconductor equipment manufacturing project officially signed a contract with an investment of RMB 2 billion, mainly focusing on high-end semiconductor equipment.
In March 2019, a new plant opened in Nanjing, a subsidiary of Foxconn Group, a semiconductor equipment manufacturer, Peixin Energy Technology Co., Ltd., broke ground.